18th International Conference on Ion Implantation Technology (IIT2010)
June 6-11, 2010
Kyoto University Clock Tower Centennial Hall
Kyoto, Japan

Recent News

November 4, 2008
Nissin Ion and SemEquip Announce the Launch of New Ion Implanter based on ClusterIon® Technology
Significant improvement of Productivity in the formation of ultrafine ultra shallow junctions for high density transistors

Nissin Ion Equipment Co., Ltd. (Kyoto, Japan; a subsidiary of Nissin Electric Co., Ltd.) recently announced the introduction of a new category of ion implanter, named CLARIS®, and has shipped the first tool to a major Japanese chip manufacturer.

July 9, 2008
CERADYNE, INC. TO ACQUIRE SEMEQUIP, INC.
Acquisition Will Open New Market for Ceradyne Semiconductor Product Line.

December 13, 2007
NEC and NEC Electronics Develop Novel Channel-Engineering Technology for Advanced CMOS Transistors
Enabled by visualization of ultra-shallow junctions based on electron beam holography

NEC Corporation and NEC Electronics Corporation have successfully developed design technology to realize optimum channel structure in CMOS transistors for advanced LSIs in the 32nm generation and beyond. This achievement relies on visualization of impurity distributions in transistors based on electron beam holography technology with world-leading high spatial resolution.

Features of the new technology
(1) Pn-junctions with low resistance and very steep impurity profiles were realized by a combination of two state-of-the-art process technologies - cluster-ion implantation that suppresses the so-called channeling effect (1) for implanted impurity atoms and diffusion-less high-temperature millisecond annealing for impurity activation. These properties are both desirable for ultra-small CMOS transistors. In addition, improvement in actual device performance was confirmed.

December 1, 2006
SemEquip, Inc. to Introduce ClusterCarbon™ Implant Material at SEMICON Japan 2006.
North Billerica, MA – December 1, 2006 - SemEquip®, an innovative leader in ion implantation sub-systems and advanced materials for semiconductor manufacturing, today announces that ClusterCarbon™ Implant Material for its ClusterIon® Source System technology will be introduced at SEMICON Japan 2006 (Booth # 2A-203) scheduled for December 6th through 8th at the Makuhari Messe, Chiba, Japan.

October 31, 2006
Axcelis Technologies, Inc. today announced the first shipment of its innovative Optima HD, powered by Imax™, to one of the world's largest memory chipmakers. This shipment marks a significant milestone by offering the industry's first implanter to deliver the power of molecular implants for both advanced memory and logic devices. This latest addition to Axcelis' Optima HD product line enables users to dramatically increase productivity and shorten low energy, high dose implant process times by implanting molecules rather than atoms.

October 3, 2006
Axcelis Technologies, Inc. has received a new design win for its Optima HD, powered by Imax™, from one of the world's largest manufacturers of memory devices. The newest tool in Axcelis' Optima ion implant family, the Optima HD Imax enables users to dramatically increase productivity and shorten low energy, high dose implant process times by implanting molecules instead of atoms. This order marks a significant new win for Axcelis' new Optima HD technology at another one of the world's top five memory chipmakers and the first penetration of Axcelis' innovative Optima HD Imax molecular implant system. The tool will ship during the fourth quarter of 2006.

June 12, 2006
Axcelis Technologies, Inc. introduced the new Optima HD, powered by Imax™, for extremely high dose, low energy implant applications used for leading-edge memory and logic devices. An extension of the company's new Optima HD platform, the Optima HD Imax enables users to dramatically increase productivity and reduce low energy, high dose process times by implanting clusters of boron, instead of individual atoms. The first Imax-enabled Optima HD tools will begin shipping by the end of the year.

August 4, 2005
SemEquip Announces Completion of $26 Million in Financing

May 24, 2005
Axcelis Marks Another Low Energy Implant Advance With Cluster Boron Beams
New SemEquip source offers 18X boost in low energy productivity